The substrate is a small PCB with traces designed specifically for your package. The substrate is used for connecting the bumps to the solder balls and consists ...
ASE's substrate design and manufacturing capability enables the interconnection materials of a wide range of wire-bond BGA and flip chip product applications.
SHINKO supplies organic substrates using prepreg for BGA packages for logic, memory, and sensor devices. 2 layers or 4 layers through-hole substrates are used ...
FC-BGA substrates. FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions.
2022年11月10日 — A BGA substrate is a carrier that you will use with several versions of BGA packages. Complex devices such as microprocessors require that ...